Method for sawing a moulded leadframe package
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United States of America Patent
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Apr 8, 2003
Grant Date -
Apr 25, 2002
app pub date -
Jun 22, 2001
filing date -
Jun 23, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a new method for sawing a moulded leadframe package (1) into individual integrated circuits (11). In the present invention sawing of the moulded leadframe package (1) is done on the leads (13) instead of on the connecting bar (14) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.
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