Rotative cutting method and device for printed circuit boards and electric conductors
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United States of America Patent
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Apr 8, 2003
Grant Date -
N/A
app pub date -
Sep 20, 2000
filing date -
Jan 24, 1998
priority date (Note) -
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Abstract
The invention relates to a method and device for producing printed circuit boards and electric conductors. The inventive device comprises a station where a conductive layer is fixed to a support material, a cutting station, connected to the first station so that the conductive layer can be cut to form a conductor and a station where cuttings are removed.
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