Circuit board/printed circuit board having pre-reserved conductive heating circuits
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United States of America Patent
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Apr 1, 2003
Grant Date -
N/A
app pub date -
Dec 10, 2001
filing date -
Dec 10, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a circuit board/printed circuit board having pre-reserved conductive heating circuits, which comprises a plurality of metal circuit substrates and a plurality of layers of insulating material. The conductive heating circuits are disposed on the metal circuit substrates. Each of the conductive heating circuits has a plurality of direct heat-generating regions. The insulating material is disposed between the metal circuit substrates. When a current is provided to the conductive heating circuits, heat required for partly bonding and hardening can be generated so that the insulating material and the corresponding positions of the direct heat-generating regions on the metal circuit substrates can be bonded and hardened together. A pre-stacked multi-layer metal circuit board with partly bonding and hardening is thus finished.
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