Solvent-free two-component curable adhesive composition
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United States of America Patent
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Mar 25, 2003
Issued Date -
N/A
app pub date -
Mar 29, 2002
filing date -
Oct 8, 1999
priority date (Note) -
Expired
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Abstract
The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80.degree. C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa.multidot.s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25.degree. C. may be 20,000 mPa.multidot.s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.
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