High temperature thermal processing alloy
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United States of America Patent
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Mar 25, 2003
Grant Date -
Dec 12, 2002
app pub date -
Aug 29, 2001
filing date -
Jan 24, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A nickel base alloy for high temperature thermal processing hardware requiring ultra-low spallation and metal loss rates in oxidizing and nitriding atmospheres for use in wire mesh belting, thermocouple sheathing, resistive heating elements, heat sensing cables, furnace internals and like hardware. The compositional range of the alloy is 15.0-23.0 % Cr, 0.5-2.0 % Si, 0.0-4.0% Mo, 0.0-1.2 % Nb, 0.0-3.0 % Fe, 0.0-0.5 % Ti, 0.0-0.5 % Al, 0.0-0.3 % Mn, 0.0-0.1 % Zr, 0.0-0.06 % Ce, 0.005-0.025 % Mg, 0.0005-0.005 % B, 0.005-0.3 % C, 0.0-20.0 % Co, balance Ni. The alloy possesses a high degree of hot and cold workability, phase stability and strength retention at elevated temperatures.
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