Mounting substrate and heat sink for high-power diode laser bars
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United States of America Patent
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Mar 18, 2003
Grant Date -
Dec 6, 2001
app pub date -
Mar 2, 2001
filing date -
Mar 3, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.
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