Arrangement for the temperature-compensated multi-dimensional micropositioning of mutually position-defined optical components
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United States of America Patent
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Mar 18, 2003
Grant Date -
Feb 14, 2002
app pub date -
Jun 14, 2001
filing date -
Jun 14, 2000
priority date (Note) -
Expired
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Abstract
An arrangement for a temperature-compensated multi-dimensional micropositioning of mutually position-defined optical components including a guide unit for housing the optical components and a plurality of piezo actors. The guide unit includes two spaced plates or rings. Also included is three equally spaced solid joints arranged or integrated between the rings or plates, and stack-type piezo actors secured in a neighbouring relationship with the solid joints in such a manner that actuation forces act on the rings or plates. Further, at least the surfaces of the rings or plates accommodating the optical components are coated with a material corresponding to that of the optical components, the guide unit and the optical components are made from materials with essentially the same temperature coefficients, and one stack-type piezo actor is arranged between two solid joints.
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