Method and apparatus for securing an electronic component
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United States of America Patent
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Mar 18, 2003
Grant Date -
N/A
app pub date -
Jan 24, 2002
filing date -
Jan 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a heat sink plate, and a second plate, such as a mounting plate. The clamping mechanism applies compression forces to the electronic component to secure the electronic component without using shear forces capable of damaging the electronic component. The clamping mechanism preferably provides thermal isolation between the heat sink plate and the mounting plate.
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