Method of making a silicon carbide rail for use in a semiconductor wafer carrier
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United States of America Patent
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Mar 18, 2003
Issued Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Oct 2, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A silicon carbide rail for use as a support in an apparatus for holding semiconductor wafers is made by forming a first series of parallel slots or grooves into the front side of a graphite plate usually without piercing the back side of the plate, converting the slotted graphite plate into a slotted silicon carbide plate, and forming a second series of parallel slots into the back side of the slotted silicon carbide plate such that each slot on the back side connects with a corresponding slot on the front side. The width of each back side slot is less than that of the corresponding front side slot, thereby forming rail teeth having a ledge running along their to top surfaces.
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