Cathode arrangement
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United States of America Patent
Stats
-
Mar 11, 2003
Grant Date -
Oct 4, 2001
app pub date -
Jan 24, 2001
filing date -
Jan 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cathode arrangement having a mounting rail (1) and a cathode plate (2) bonded to the mounting rail (1). Two parallel, flanges extending in its longitudinal direction are formed on the underside (5) of the mounting rail (1). The cathode plate (2) is accommodated and bonded to the flanges (8, 9) by explosion welding between the parallel flanges. A full-surface metal-to-metal bond is thus obtained, which has very good current-conducting properties at the contact surfaces between the flanges (8, 9) and the cathode plate (2). The ends of the mounting rail (1) projecting over the cathode plate (2) have a flangeless design and have oblique surfaces (6, 7) intersecting in the shape of a wedge on the underside.
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