Computation of die-per-wafer considering production technology and wafer size
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United States of America Patent
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Mar 4, 2003
Grant Date -
N/A
app pub date -
Dec 28, 1999
filing date -
Dec 28, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is a method and system for efficiently computing the number of die per wafer and the corresponding number of stepper shots. In an example embodiment, dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size.
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