Method and device for producing segmented contact adhesive layers and for applying the same on a substrate
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United States of America Patent
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Mar 4, 2003
Grant Date -
N/A
app pub date -
Nov 6, 2000
filing date -
May 7, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a process and a device for manufacturing segmented pressure-sensitive adhesive layers and applying the same to a substrate, involving the use of a reaction medium containing radiation-inducible polymers and/or prepolymers of olefinically unsaturated compounds and the addition of a photoinitiator.
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