Rain sensor with bonded chips
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United States of America Patent
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-
Mar 4, 2003
Grant Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Jun 14, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention is a rain sensor including a transmitter and receiver formed by chips bonded onto a printed circuit board. Advantageous embodiments of the invention provide filtering of radiation guided to the receiver of the sensor. The sensor is provided with a barrier to suppress parasitic radiation.
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