Method of manufacture of printed wiring boards and flexible circuitry
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United States of America Patent
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Feb 25, 2003
Grant Date -
Mar 21, 2002
app pub date -
Dec 19, 2000
filing date -
Dec 20, 1999
priority date (Note) -
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Abstract
The present invention relates to the fabrication process for the printed wiring boards and flex circuits. An electrostatic printing plate includes a substrate with an image receiving layer applied thereto. The image receiving layer is a toner with a metallic toner and subsequently fixed in place or is transferred to a layer. The metal toner is then fixed on this receiving surface.
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