Copper foil for printed circuit boards and its surface treatment method
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United States of America Patent
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-
Feb 25, 2003
Grant Date -
Feb 14, 2002
app pub date -
Apr 12, 2001
filing date -
Apr 28, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a copper foil--for printed circuit boards--which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m.sup.2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m.sup.2 of chromium and, if necessary, 1.5 to 6 mg/m.sup.2 of phosphorus. The process of treating the surface of copper foil for printed circuit boards comprising the steps of forming the first layer composed of a sulfur-contained zinc alloy by electrolysis by dipping at least the surface on one side of the copper foil in a solution containing a zinc compound and a sulfur compound and forming the second layer composed of chromate by electrolysis by dipping said first layer in a solution containing a chromium compound, or a chromium compound and a phosphorus compound.
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