Facility for the thermal treatment of workpieces
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United States of America Patent
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-
Feb 25, 2003
Grant Date -
Jan 3, 2002
app pub date -
Jun 28, 2001
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.
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