Method and system for varying die shape to increase wafer productivity
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United States of America Patent
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Feb 18, 2003
Grant Date -
N/A
app pub date -
Dec 28, 1999
filing date -
Dec 28, 1999
priority date (Note) -
Expired
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Abstract
A method and system thereof for maximizing integrated circuit die production. In an example embodiment, the method is implemented on a server computer system in a client-server computer system network. In this embodiment, the server computer system receives from a client computer system a wafer size, a scribe lane width, and the dimensions for a die. A die count and a stepper shot count corresponding to the dimensions are determined using one or more lookup tables. A lookup table is associated with each combination of wafer size and scribe lane width. A measure of die production is calculated using the die count and the stepper shot count and transmitted to the client computer system. The dimensions can be changed and a new measure of die production calculated using the changed dimensions, until a maximum value of the measure of die production is determined.
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