Multilayer printed circuit board having signal, power and ground through holes
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United States of America Patent
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Feb 18, 2003
Grant Date -
N/A
app pub date -
May 4, 1999
filing date -
May 13, 1998
priority date (Note) -
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Abstract
A multilayer printed circuit board enables needless electro-magnetic radiation to be suppressed. Interlayer insulation materials are arranged in layer-built constitution between respective layers of a mixed wiring layer of a first signal and/or a power supply wiring, a first ground layer, a second ground layer, and a mixed wiring layer of a second signal and/or a power supply wiring. A through-hole for connecting the ground layers with each other is provided adjacently to a through-hole for connecting the signal and/or the power supply between these layers. According to the constitution, a return circuit current route of the signal and the power supply to the ground layers is secured. As a result, a loop made by the current becomes small, thus needless radiation of electro-magnetic wave is capable of being suppressed.
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