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Abstract

A process of performing via-filling efficiently and by a simple procedure is disclosed. The via-filling process comprises providing a substrate having blind via-holes, making the substrate electrically conductive, and plating the substrate in an acid copper plating bath which comprises the following components (A) to (E): (A) copper sulfate at a concentration of 100-300 g/L, (B) copper sulfate at a concentration of 30-150 g/L, (C) a first component (polymer component) such as polyethylene glycol, polypropylene glycol, and Pluronic surfactants, at a concentration of 10-1000 mg/L, (D) a second component (carrier component) such as sodium sulfoalkyl sulfonates and bis-sulfo organic compounds at a concentration of 0.1-20 mg/L, and (E) a third component (leveler component) such as polyalkylene imines, 1-hydroxyethyl-2-alkyl imidazoline chlorides, auramine and its derivatives at a concentration of 0.05-10 mg/L.

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First Claim