Apparatus for polishing a semiconductor wafer
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Jun 17, 1998
filing date -
Jun 19, 1997
priority date (Note) -
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Abstract
An polishing apparatus consists of a piston which is fixed to the rotation axis, a ceramic plate which is oppositely arranged against the piston via a silicone gel, and a cylinder which houses these components. The wafer is attached on the bottom surface of a backing pad, and will be pressed and rotated by the piston in order to polish the surface thereof.
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