Polishing apparatus and method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 11, 2003
Grant Date -
Oct 4, 2001
app pub date -
Mar 6, 2001
filing date -
Mar 7, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A polishing apparatus which attaches the semi-conductor wafers 5 to the polishing plate 4 for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring 7 disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring 8 provided at the lower end of the guide ring for contacting the polishing cloth, and a weight 9 detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.
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