Shaping polishing pad for small head chemical mechanical planarization
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United States of America Patent
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Feb 11, 2003
Grant Date -
N/A
app pub date -
Oct 26, 2000
filing date -
Oct 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Specific embodiments of the present invention are directed to a method of forming a polishing pad having a smaller diameter than an object to be planarized and to be used for planarizing the object by chemical-mechanical planarization. The method comprises placing a polishing surface of the polishing pad in contact with an abrasive surface of a conditioning object having a shape identical to the object to be planarized. The polishing surface of the polishing pad is engaged with the abrasive surface of the conditioning object under conditions substantially equal to the conditions to be applied for planarizing the object. The polishing surface is observed, and is disengaged from the abrasive surface of the conditioning object when abrasion of a center region of the polishing surface of the polishing pad by the abrasive surface of the conditioning object is initially detected. In a specific embodiment, another polishing pad is preformed to have the shape of the polishing surface of the polishing pad after disengaging the polishing pad from the conditioning object. That polishing pad may be preformed by molding.
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