Semiconductor integrated circuit
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United States of America Patent
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Feb 11, 2003
Issued Date -
N/A
app pub date -
Jun 7, 2001
filing date -
Jan 7, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing .mu.BGA.multidot.IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. The center line of the inner lead is recognized, the inner lead is pushed to the chip in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.
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