Composition of epoxy resin and triazine-formaldehyde-phenol resin
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 4, 2003
Grant Date -
Oct 18, 2001
app pub date -
Feb 15, 2001
filing date -
Feb 15, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): ##STR1## wherein R.sub.1 and R.sub.2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R.sub.3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully