Photosensitive polymer composition, method for forming relief patterns, and electronic parts
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United States of America Patent
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Feb 4, 2003
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N/A
app pub date -
Mar 30, 2001
filing date -
Oct 30, 1998
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Abstract
A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.
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