Apparatus and method for purging injection molding system
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United States of America Patent
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Feb 4, 2003
Issued Date -
N/A
app pub date -
Sep 7, 2000
filing date -
Apr 21, 1998
priority date (Note) -
Expired
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Abstract
An injection molding apparatus, system and method are provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method of open-mold purging is provided in an injection molding system including a manifold to receive material injected from an injection molding machine. The method includes the steps of selecting a target purge pressure; injecting material from the injection molding machine into the manifold; and controlling the purge pressure to substantially track the target purge pressure, wherein the purge pressure is controllable independently from the injection molding machine pressure.
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