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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TOKYO ELECTRON LIMITED	AKASAKA BIZ TOWER 3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

International Classification(s)

• C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
• H05H:PLASMA TECHNIQUE
• C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Denpoh, Kazuki	Nirasaki, JP	30	1463
# of filed Patents : 30 Total Citations : 1463

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Patent Citation Ranking

• 9 Citation Count
• C23C Class

• 2.74 % this patent is cited more than
• 22 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 04, 2003	US,6514347,B2   US6514347B2	GRANTED PATENT AS SECOND PUBLICATION
August 23, 2001	US,20010015262,A1   US20010015262A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 6514347

Apparatus and method for plasma treatment

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Abstract

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A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compensation ring member 32 is made such thin as one to three times mean free path of treatment gas molecules, thereby suppressing heat transfer between a susceptor 30 and a second compensation ring member 33. A base of a second compensation ring member, through a layer of conductive silicone rubber 34, is made to come into an intimate contact with an upper surface of a susceptor 30, thus helping to cool.

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Description

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Claims

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Legal Events

 

• FPAY2014
• FPAY2010
• FEPP2009
• FPAY2006
• I2003
• STCF2003
• P2001
• F2001
• AS2001
• PD2000

Date	Code	Event	Description
Jul 09, 2014	FPAY	FEE PAYMENT	year of fee payment: 12
Jul 08, 2010	FPAY	FEE PAYMENT	year of fee payment: 8
Nov 01, 2009	FEPP	FEE PAYMENT PROCEDURE	free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Jul 07, 2006	FPAY	FEE PAYMENT	year of fee payment: 4
Feb 04, 2003	I	Issuance
Jan 16, 2003	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Aug 23, 2001	P	Published
Feb 14, 2001	F	Filing
Feb 01, 2001	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DENPOH, KAZUKI;REEL/FRAME:011654/0862 Owner name: TOKYO ELECTRON LIMITED, JAPAN Effective Date: Feb 01, 2001
Feb 14, 2000	PD	Priority Date