Polishing chemical delivery for small head chemical mechanical planarization
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United States of America Patent
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Feb 4, 2003
Grant Date -
N/A
app pub date -
Oct 26, 2000
filing date -
Oct 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. A channel extends along the shaft axis through the shaft and the polishing head. A supply tube is configured to deliver a polishing chemical through the channel to the polishing pad. In some embodiments, the polishing pad is an annular pad having an opening for flowing the polishing chemical therethrough to a region between the polishing pad and the object. A sensor is provided for monitoring a level of the polishing chemical in the channel of the shaft. A pump is provided for pumping the polishing chemical through the supply tube to the channel of the shaft. The pump is controlled to vary a flow rate of the polishing chemical to the channel of the shaft in response to the monitored level of the polishing chemical in the channel.
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