Methods using dry powder deposition apparatuses
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United States of America Patent
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Jan 28, 2003
Issued Date -
N/A
app pub date -
Mar 21, 2000
filing date -
Jun 10, 1998
priority date (Note) -
Expired
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Abstract
Provided is a method using a dry deposition apparatus for depositing grains on a substrate comprising: an electrostatic chuck having one or more collection zones, wherein the substrate is layered on the chuck for processing; a charged grain delivery apparatus for directing charged grains for electrostatic deposition on the substrate at the locations of the collection zones; and an optical detection device for quantifying the amount of grains deposited.
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