Method of producing semiconductor devices having easy separability from a metal mold after molding
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United States of America Patent
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Jan 28, 2003
Grant Date -
N/A
app pub date -
Feb 23, 2000
filing date -
Jun 25, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.
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