Gold plating solution and gold plating method using thereof
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United States of America Patent
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Jan 28, 2003
Grant Date -
N/A
app pub date -
Aug 17, 2001
filing date -
Aug 17, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A non-cyanide electrolytic gold plating solution excellent in its solution stability, and a method for gold plating using thereof. A non-cyanide electrolytic gold plating solution according to the present invention containing a trivalent gold compound which is a gold hydroxide salt and/or chloroaurate salt; a chelating agent which is a hydantoin compound of imidazolidinedione, 5,5-dimethylhydantoin, or hydantoic acid; a buffer; and a conductive salt, wherein the concentration of the gold in the gold plating solution is 0.5 to 30 g/L, the concentration of the chelating agent in the gold plating solution is 0.1 to 2.5 M/L, and pH is 5.0 to 10.0.
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- 1 Citation Count
- C23C Class
- 2.74 % this patent is cited more than
- 22 Age