High thermal conductivity lossy dielectric using a multi layer configuration
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United States of America Patent
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Jan 21, 2003
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N/A
app pub date -
Sep 17, 1999
filing date -
Sep 17, 1999
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Expired
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Abstract
Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives.
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