Apparatus for reducing an electrical noise inside a ball grid array package
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United States of America Patent
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Jan 21, 2003
Grant Date -
N/A
app pub date -
May 22, 2000
filing date -
May 22, 2000
priority date (Note) -
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Abstract
An apparatus for reducing an electrical noise inside a ball grid array package is disclosed. The apparatus mainly comprises a substrate, a plurality of solder balls and a plurality of inside-connected capacitors. The substrate includes a contact layer, a power plane and a ground plane. The plurality of solder balls are fixed on the contact layer. The plurality of inside-connected capacitors are fixed on the contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground plane.
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