Method of forming an in-situ void system
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United States of America Patent
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-
Jan 21, 2003
Grant Date -
Oct 10, 2002
app pub date -
Apr 9, 2001
filing date -
Apr 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming an in-situ void system including the steps of determining an expansion potential of soil adjacent to a structure and forming an array of voids in an area adjacent to the structure so as to accommodate the expansion potential of the soil. The array of voids is formed by drilling an array of holes beneath the structure or around a perimeter of the structure. The holes are drilled to a depth of the expansion potential. A liquid can be introduced into the voids so as to swell the soil. The top of the array of voids is covered prior to laying the foundation over the array of voids.
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