Low viscosity thermally conductive compositions containing spherical thermally conductive particles
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 31, 2002
Grant Date -
N/A
app pub date -
May 8, 2001
filing date -
May 19, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention discloses a thermally conductive adhesive composition that is useful for encapsulating electronic parts. More particularly, this invention provides adhesive compositions that have 90% of the alumina particles having an average diameter sufficiently low to maintain the particles in suspension. The thermally conductive compositions of the present invention have a low viscosity and excellent thermal conductivity properties. Also contemplated is an electronic part that is encapsulated with the inventive composition, an article of manufacture having a container with the inventive composition contained therein and a method of manufacturing the inventive thermally conductive adhesive composition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully