Method for appraising the condition of a semiconductor polishing cloth
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 17, 2002
Grant Date -
Oct 4, 2001
app pub date -
Mar 10, 1999
filing date -
Mar 10, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a method for appraising the condition of a polishing cloth, and a method for manufacturing semiconductor wafers employing the disclosed appraisal method, allowing acceptably low light point defect numbers of semiconductor wafers to be maintained. The disclosed method comprises polishing the semiconductor wafer using a polishing cloth, washing the wafer, and drying the wafer. The size of particles comprising light point defects is chosen, and the number of light point defects on the semiconductor wafer is counted. Typically, the diameter of particles comprising light point defects is set as 0.12 .mu.m or greater. The polishing cloth is exchanged when the number of light point defects counted exceeds a prescribed number.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully