Apparatus and method for handling substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 17, 2002
Grant Date -
N/A
app pub date -
Oct 24, 2000
filing date -
Apr 24, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and method are provided for handling substrates that are provided with an inner hole. The apparatus includes an inner gripper in the form of an inner hole gripper, and an outer gripper that is embodied as a vacuum gripper and is provided with a ring in which are disposed a plurality of suction devices. A control unit controls the inner and outer grippers such that they are moved relative to one another, while they grasp one and the same substrate, for deforming or bending the substrate. According to the method, a first substrate is grasped by the inner hole gripper, is brought into contact with an outer gripper, and is grasped by the outer gripper. The inner hole gripper is released and moved through the hole in the first substrate and then grasps a second substrate. After releasing the second substrate, the inner hole gripper again grasps the first substrate and the inner and outer grippers are moved relative to one another to bend the first substrate, whereupon the center portion of the bent first substrate is brought into contact with the second substrate. Thereafter, the remaining portions of the first substrate are brought into contact with the second substrate.
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