Non-invasive electrical measurement of semiconductor wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 10, 2002
Grant Date -
N/A
app pub date -
Oct 19, 2000
filing date -
Oct 19, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor wafer probe assembly (10) includes a chuck assembly (18, 20) configured to receive a back surface (30) of a semiconductor wafer (14) and an electrical contact (20) for contacting the semiconductor wafer (14). A probe (36) having an elastically deformable conductive tip (38) is movable into contact with a semiconducting material forming a front surface (13) of the semiconductor wafer (14) or with a front surface (34) of a dielectric (12) formed on the front surface of the semiconducting material. A tester (82) is connected for applying an electrical stimulus between the electrical contact (20) and the conductive tip (38) for measuring a response to the electrical stimulus and for determining from the response at least one electrical property of the semiconducting material and/or the dielectric (12).
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