Gold wire for semiconductor element connection and semiconductor element connection method
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United States of America Patent
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Dec 10, 2002
Grant Date -
Jan 24, 2002
app pub date -
May 31, 2001
filing date -
May 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A gold wire, for semiconductor element connection, having 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, and 1-100 ppm by weight of Y. The gold wire further preferably has 1-100 ppm by weight of at least one of Eu, La, Ce and Lu, as well as 1-100 ppm by weight of at least one of Mg and Ti. The total amount of the added elements being no greater than 200 ppm by weight. The balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.
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