Solderable aluminum
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United States of America Patent
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Dec 10, 2002
Grant Date -
N/A
app pub date -
Sep 18, 2000
filing date -
Dec 2, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention is directed to a solderable aluminum alloy having an aluminum alloy which is formable into a substrate. The aluminum alloy has 0.05-4.5% by weight of tin added to the aluminum alloy to be formed into the substrate. The invention is also directed to a process for preparing a solderable aluminum substrate. The process includes preparing an aluminum slug with 0.05-4.5% of tin added to the aluminum slug; then rolling the aluminum slug to the desired thickness for the substrate; finally forming the rolled slug into the final shaped of the substrate.
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