Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
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United States of America Patent
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-
Dec 3, 2002
Grant Date -
Jun 6, 2002
app pub date -
Apr 30, 2001
filing date -
Dec 4, 2000
priority date (Note) -
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Abstract
A semiconductor device comprises: a semiconductor element; an external terminal used for an external connection; an interposer having the semiconductor element mounted on a first surface thereof and having the external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect the semiconductor element and the external terminal; a resin sealing the semiconductor element on the first surface; and an interconnecting portion formed within the resin, the interconnecting portion having a first connecting part electrically connected to the external terminal and having a second connecting part exposed on an outer surface of the resin.
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