Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound
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United States of America Patent
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Dec 3, 2002
Grant Date -
Sep 6, 2001
app pub date -
Feb 21, 2001
filing date -
Feb 21, 2000
priority date (Note) -
Expired
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Abstract
A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300.degree. C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.
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