Health support device and method of producing the same
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United States of America Patent
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Dec 3, 2002
Issued Date -
N/A
app pub date -
Sep 19, 2000
filing date -
Apr 1, 1998
priority date (Note) -
Expired
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Abstract
A health support device having a lamination of a semiconductor film on a surface of a partially-reduced sintered material of titanium oxide. The semiconductor film is preferably a p-type semiconductor film of silicon or germanium. The partially-reduced sintered material is preferably represented by TiO.sub.2-x, where 0<.times.<0.5. The thickness of the semiconductor film is preferably from 1 nm to 500 nm. In production, a mixture of a titanium oxide powder and a binder is press-molded, and the molded material is sintered at a temperature of from 500.degree. C. to 1100.degree. C. in a vacuum, inert or reducing atmosphere. A p-type semiconductor film is formed on a surface of the resulting partially-reduced sintered material of titanium oxide.
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