Heat dissipation module for a BGA IC
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United States of America Patent
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Nov 26, 2002
Grant Date -
Feb 21, 2002
app pub date -
Aug 15, 2001
filing date -
Aug 17, 2000
priority date (Note) -
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Abstract
An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
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