Semiconductor module and power converting apparatus using the module
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United States of America Patent
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Nov 26, 2002
Grant Date -
N/A
app pub date -
Apr 20, 2000
filing date -
Oct 20, 1997
priority date (Note) -
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Abstract
A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.
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