Baffle system for air cooled computer assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 19, 2002
Grant Date -
N/A
app pub date -
Jul 20, 2000
filing date -
Jul 20, 2000
priority date (Note) -
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Abstract
An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs. One curved baffle is positioned between one memory ASIC and the outside of the PCB assembly and the other curved baffle is positioned between the other memory ASIC and the opposite side of the PCB assembly. The curved baffles include a curved portion, an extended portion and a front portion. The heat producing components include memory DIMMS, 4 130 watt microprocessors, and two 40 watt memory ASICs.
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