Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 19, 2002
Grant Date -
Aug 15, 2002
app pub date -
Feb 9, 2001
filing date -
Mar 23, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
This invention provides a technique capable of solving a problem of an ununiform plating on an annular edge portion of a surface to be plated of a wafer, which ununiform plating is usually caused due to an ununiform flow of a plating apparatus, thereby ensuring a uniform plating treatment on the entire surface to be plated of a wafer. The present invention is directed to a cup-shaped plating apparatus comprising a wafer support section provided along an upper opening of a plating tank, a plurality of solution-outlet passages provided below the wafer support section and extending from the inside of and to the outside of the plating tank and at least one solution-supply pipe provided through the bottom of the plating tank.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully