Device for cooling diode lasers
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United States of America Patent
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-
Nov 12, 2002
Grant Date -
N/A
app pub date -
Oct 20, 2000
filing date -
Oct 21, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a device for cooling diode lasers, it is aimed to increase the heat transfer coefficient, with a low overall height of the device, in such a manner that the pressure losses occurring also effectively ensure that stacked heat sinks are operated in parallel in terms of flow. Channels arranged in superimposed planes are divided, in each plane, into groups which are flow-connected in series and, in order to be connected in series, open out into flow-connecting links which are common to the superimposed planes. The device is suitable as a heat sink for diode lasers, in particular for cooling diode laser arrays and stacks thereof.
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