Apparatus and method for processing micro-V grooves

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6478661
APP PUB NO 20010021629A1
SERIAL NO

09794909

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.

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Patent Owner(s)

Patent OwnerAddress
RIKEN2-1 HIROSAWA WAKO-SHI SAITAMA 3510198 ?3510198
NEXSYS CORPORATION THENINTH FLOOR HIROSE-BUILDING 3017 KANDANISHIKI-CHO CHIYODA-KU TOKYO 101-0054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asami, Muneaki Tokyo, JP 3 11
Ebizuka, Noboru Mitaka, JP 4 167
Morita, Shinya Tokyo, JP 111 2630
Moriyasu, Sei Tokyo, JP 10 179
Ohmori, Hitoshi Wako, JP 51 531
Yamagata, Yutaka Wako, JP 51 1037

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