Heat sink and electronic assembly including same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Jul 17, 2001
filing date -
Jul 17, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to the mounting surfaces on the heat sink at one or more levels. Some of the mounting surfaces can be formed on mounting ridges, which define channels. Ventilation apertures located between the fins extend through the base portion such that air is drawn through the channels and up through the apertures creating a 'chimney' effect. The heat sink is also grounded to at least one of the PWBS and electrically isolated from the chassis. Isolator bushings can be mounted in one or more of the fins for receiving pins extending from the chassis to insure mechanical support and isolation/dampening and to insure electrical isolation from the chassis.
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